A Dual In-Line Package or DIP is a type of electronic component package that has a rectangular body with two rows of parallel pins for electrical connections.
The DIP was devised in 1964 by Don Forbes, Rex Rice, and Bryant Rogers at Fairchild R&D as a solution to the limited number of leads present on circular transistor-style packages that restricted the use of integrated circuits. These packages can be mounted through-hole to a PCB or plugged into a socket. With time, the evolution of complex microprocessors and electronic devices demanded more pins than could be accommodated within a DIP package. This subsequently led to the invention of higher-density chip carriers.
The standard term used for DIP is DIPn, where n is the total number of pins on the package. DIP packages are available in a variety of integrated circuit types. The number of pins can range from three to 64.
Ribbon cable DIP plugs are compatible with common IC sockets, making these packages widely used in the digital and analog fields.
What is the use of a Dual In-Line Package?
A DIP is used as an effective package solution for a broad range of integrated circuit components, including transistors, resistors, light-emitting diodes, switches, and arrays of all these components.
When was DIP invented?
The dual-inline package format was invented in 1964 by Don Forbes, Rex Rice, and Bryant Rogers at Fairchild R&D n California.
What does DIP stand for?
DIP stands for Dual In-Line Package.
The Dual In-Line Package (DIP) is an electronic component package widely used in the digital and analog fields. It is ideal for ICs that require fewer leads and has the unique feature of being mounted through-hole to a printed circuit board (PCB) or plugged into a socket. DIP is available in a wide variety of analog and digital integrated circuit types, as well as in arrays of transistors, switches, light-emitting diodes, and resistors.