Surface mount technology (SMT) is a method of assembling circuit boards in which the components are mounted directly onto the board’s surface, eliminating the need for drilling holes for thru-hole devices. Instead, the chip and component leads are soldered on top of the board.
The benefits of SMT are many. For one, it allows for the production of boards more quickly due to the elimination of drilling. Additionally, SMT can enable a designer to utilise the space beneath the device for additional layers, and since the chips are smaller, the boards can also be smaller. SMT packages like BGA have no leads sticking out the edges.
Surface mount technology is widely used in many industries for the creation of high-quality and efficient electronic products, such as smartphones, tablets, and computers. It has become the standard in electronic manufacturing due to its efficiency, speed, and precision.
What are the disadvantages of SMT?
SMT is a highly advanced manufacturing process that requires specialised equipment and skilled technicians. It can be challenging to repair and replace SMT components due to the small size of the components and the complexity of the technology.
What is the difference between SMT and through-hole technology?
Through-hole technology relies on drilling holes in a printed circuit board for each component. In contrast, surface mount technology mounts components directly onto the board’s surface, reducing manufacturing time and increasing design flexibility.
Surface mount technology is a game-changer in the electronic manufacturing industry. It offers many advantages over through-hole technology, including faster production times, increased design flexibility, and smaller boards. While SMT requires skilled technicians and specialised equipment, it is the go-to technology for producing high-quality and efficient electronic products.