System in Package (SiP) refers to a complete system that is packaged in a single housing. This multichip module (MCM) is composed of multiple integrated circuits (chips) and includes a CPU. It can be made of ceramic or laminate.
SiP is a significant advancement in the world of electronics. By packing multiple ICs or components of an entire system within a small space, SiP can lower power consumption and reduce the total system cost. It provides faster signals and short interconnects, which results in higher performance, smaller form factors, and more significant functionality.
Amkor Technologies coined the term SiP and used it for the first time in the late 1990s; however, it was not registered as a trademark. SiP is popular today in the manufacturing of smartphones, tablets, and wearable devices.
What are the benefits of using SiP?
SiP can reduce power consumption, lower the total system cost, provide smaller form factors, and higher performance.
Where is SiP commonly used?
SiP is popular today in the manufacturing of smartphones, tablets, and wearable devices.
System in Package (SiP) has revolutionized the electronics industry by packing multiple components into a single package. It’s an advanced solution to overcome size, power, and performance challenges, making it an ideal choice for electronic devices used today.