Tape Automated Bonding (TAB) is a modern and efficient bonding method used in the electronics industry. This process involves bonding bare chips to a polyimide sheet which is then placed on a Printed Circuit Board (PCB). The tape is then cut and the leads are soldered to the board. This process minimizes the space required by the chip and is more cost-effective than traditional bonding methods.
The bonded assembly is then “glob topped” with epoxy or plastic, thereby enclosing the bare chip. The result is known as a “tape carrier package” (TCP), which is a compact, lightweight, and reliable packaging solution for a variety of electronic devices.
Advantages of Tape Automated Bonding (TAB)
- Reduced size and weight: Since the tape carrier package is compact, it requires less space on the PCB, thus reducing the overall size and weight of the device.
- Improved reliability: The encapsulation of the bare chips in the tape carrier package provides better protection against harsh environments, such as high temperature and humidity, which can cause failure in electronic devices.
- Cost-effective: The TAB process is less expensive than conventional bonding methods as it requires fewer components and utilizes less space on the PCB.
- Efficient production: The TAB process is fully automated, enabling high volume production with minimal human intervention.
What types of devices are suitable for TAB?
Tape Automated Bonding (TAB) is suitable for a wide range of devices, including microcontrollers, sensors, and memory chips.
What are the benefits of using TAB for microelectronics?
TAB offers several benefits to microelectronics, including reduced size, weight, and improved reliability.
Tape Automated Bonding (TAB) is a versatile and efficient bonding method that offers a range of benefits to microelectronics. Whether you’re looking for a compact design, improved reliability, or cost-efficient production, TAB is a reliable and proven option.