A via is a conducting channel between layers of a printed circuit board, created by drilling a hole at the intersection of layers and coating it with copper.
FAQ – Understanding Vertical Interconnect Access (VIA)
What are VIAs?
VIAs or Vertical Interconnect Access are the conducting channels within or between layers of a printed circuit board that allow signals, power, and ground connections to pass through.
What is the purpose of VIAs?
VIAs are essential to printed circuit board design as they allow connections between different layers of the board and bring electrical power, signals, and ground connections to different parts of the board.
How are VIAs made?
VIAs are made by drilling a hole through the circuit board at the intersection of the layers. The hole is then coated with copper either partially or completely to act as a conductive pathway.
What are the different types of VIAs?
There are different types of VIAs depending on the design and structure of the printed circuit board. Some of the most common VIA types include:
– Blind VIAs: These are VIAs drilled from the outer surface of the board and they only connect to one layer of the board.
– Buried VIAs: These are VIAs drilled between the layers of the board and do not reach any external layer.
– Through VIAs: These are VIAs drilled through the entire board, connecting all of its layers.
WHAT is Vertical Interconnect Access (VIA)?
Vertical Interconnect Access (VIA), also known as plated through holes, is the process of creating an electrical connection between different layers of a printed circuit board.
This connection is essential to ensure that the different components of a printed circuit board work correctly, allowing power, signals, and ground connections to reach their intended destinations.
VIAs are created by drilling holes through the layers of the circuit board, which can either be partially or completely coated with copper to act as a conductive pathway.
In addition to this, VIAs can be classified into different types based on their design and structure. These include blind VIAs, buried VIAs, and through VIAs.
Blind VIAs are used when there is a need to connect an outer layer of the board to an inner layer, while buried VIAs are used when connections need to be made between different inner layers of the board. Through VIAs, on the other hand, connect all the layers of the board in a straight line.
In The end, Vertical Interconnect Access (VIA) is the process of creating an electrical connection between different layers of a printed circuit board and is an essential component of PCB design. Understanding the different types of VIA is crucial to ensure that the different components of the board work correctly and reliably.