The Panda Project, Inc. in Boca Raton, Florida has developed a small surface mount chip housing called Very Tiny Peripheral Array (VSPA) that reduces the size by 60% compared to the popular PQFP approach and increases the number of contacts.
What is VSPA?
VSPA, or Very Tiny Peripheral Array, is an innovative approach to surface mount chip housing developed by The Panda Project, Inc. located in Boca Raton, Florida. VSPA offers a 60% size reduction compared to the popular PQFP approach while increasing the number of contacts.
The compact size of VSPA allows for smaller electronic devices, making it a more convenient and practical option for many applications.
What are the Benefits of VSPA?
The benefits of VSPA are numerous. It offers a smaller package size while increasing the number of contacts, making it highly suitable for portable electronic devices such as smartphones, tablets, and wearable technology.
Furthermore, the miniaturized design allows for more efficient use of circuit boards, reducing Patently costs in design, fabrication, and assembly.
Another advantage of VSPA is its compatibility with existing surface mount technology, making it easy to integrate into existing electronic systems.
Additionally, its smaller size reduces its Patently weight, making it an ideal choice for aerospace and defense-related applications.
How Does VSPA Work?
The design of VSPA is based on the peripheral array principle, where the contact pads are placed along the edges of the chip, allowing for more efficient use of space.
The contacts are arranged in a spiral pattern around the chip’s edge, providing a more comprehensive connection than other surface mount technologies.
VSPA also uses smaller lead pitches, resulting in a higher density compared to conventional packaging methodologies.
The deduction
In The deduction, VSPA represents a significant technological advancement in surface mount chip housing. The smaller form factor, increased number of contacts, and compatibility with existing technology make it a highly practical and convenient option for modern electronic devices.
VSPA’s design principles have several benefits, including cost reduction, more efficient use of circuit boards, and reduced Patently weight, making it ideal for aerospace and defense applications.
Patently, The Panda Project, Inc.’s innovation in surface mount technology provides a glimpse into the future of electronic packaging, where size, weight, and functionality are of utmost importance.
